Dr. Karmjit Singh Sandha
Associate Professor and Associate Head
Specialization
VLSI Interconnects, MWCNT Based Interconnects, Optical Interconnects and Embedded Systems
kssandha@thapar.edu
VLSI Interconnects, MWCNT Based Interconnects, Optical Interconnects and Embedded Systems
PhD (MWCNT based VLSI Interconnects), M.Tech (ECE), B.E. (ECE)
Designation: Associate Professor and Associate Head
Department of Electronics and Communication Engineering.
Thapar Institute of Engineering and Technology, Patiala - 147004
E-mail: kssandha@thapar.edu, aheced1@thapar.edu,
Sr. No. |
Title of Paper |
Author(s) |
Name of the Journal |
Vol./ page numbers |
Year |
Publisher |
Impact Factor |
|
G Singh, KS Sandha, A Kansal
|
Journal of Magnetism and Magnetic Materials |
608, 172454
|
2024 |
Elsevier |
2.5/Q3 |
|
|
A Tripathi, KS Sandha
|
Biomass Conversion and Biorefinery
|
doi.org/10.1007/s13399-024-06157-1 |
2024 |
Springer |
3.5/Q2 |
|
|
Investigation of Optical Interconnects for nano-scale VLSI applications. |
A Singh, KS Sandha, MK Rai |
Micro and Nanostructures |
2024 |
Elsevier |
2.7 |
|
|
Variable Length and Temperature-Dependent Analysis of MLGNR at Nano-Scale Regime |
H Sharma, KS Sandha
|
Nano |
19 (03), 2450019 |
2024 |
1.0 |
|
|
Thermally-aware circuit model and performance analysis of MLGNR for nano-interconnect application |
H Sharma, KS Sandha
|
Analog Integrated Circuits and Signal Processing, |
1-11
|
2024 |
Springer |
1.321 |
|
A Singh, KS Sandha, MK Rai
|
Journal of Circuits, Systems and Computers |
33 (07), 2450125
|
2024 |
1.278 |
||
|
Impact of sole layer duple substrates on GA-based optimised graphene antennas for THz applications |
G Singh, KS Sandha, A Kansal
|
Nano Communication Networks |
40, 100508
|
2024 |
Elsevier |
2.9 |
|
Rapid Fabrication Technique for Dry Electrocardiography Electrodes Using Carbon Nanotube/Polydimethylsiloxane Composite. |
Panchal, J., Singh, M.I., Sandha, K.S. and Singh, M. |
Journal of Electronic Materials |
53 (5), 2633-2645 |
2024 |
Springer |
2.048
|
|
Gurjeevan Singh, Karmjit Singh Sandha, Ankush Kansal |
Micro and Nanostructures |
Volume 179, July 2023, 207566 |
2023 |
Elsevier |
3.2 |
|
|
Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes |
Gurleen Dhillon, Karmjit Singh Sandha |
Journal of Electrical Engineering |
Vol. 74, No. 1, 57–63 |
2023 |
Sciendo Paper |
0.8 |
|
Impact of thickness and wt. % on the dielectric properties of Sugarcane bagasse & MWCNT composite material as microwave absorber |
Anju Tripathi, Karmjit Singh Sandha |
Waste and Biomass Valorization
|
Vol.14 No. 6 Pages 2009-2024
|
2022 |
Springer |
3.449 |
|
Stability and Crosstalk Based Performance of Multi and Double-walled mixed CNT bundles as Interconnect for next-generation Technology nodes |
Gurleen Dhillon, Karmjit Singh Sandha |
Journal of Circuits, Systems and Computers |
2022 |
1.278 |
||
|
Analytical Delay Model and Stability Analysis for MLGNR Interconnects |
Himanshu Sharma, Karmjit Singh Sandha. |
Journal of Circuits, Systems and Computers |
2022 |
1.278 |
||
|
Impact of channel parameters on threshold voltage at variable temperatures of Double-gate CNTFET |
Aakanksha, Karmjit Singh Sandha |
Micro and Nanostructures |
Volume 164, April 2022, 107168 |
2022 |
Elsevier |
3.22 |
|
Mixed CNT bundles as VLSI interconnect for nanoscaled technology nodes |
G. Dhillon, K.S.Sandha |
Journal of Computational Electronics, |
Vol.20, No. 1, pp. 248-258 |
2021 |
Springer |
1.983
|
|
Impact of thermally-aware environmental conditions on double gate carbon nanotube FET |
Aakankshal, Karmjit Singh Sandha |
Microelectronics Journal |
Volume 114, pp- 105146 |
2021 |
Elsevier |
2.2 |
|
Coupled microalgal–bacterial biofilm for enhanced wastewater treatment without energy investment |
Karmjit Singh Sandha, et. al |
Journal of Water Process Engineering |
Volume 41, pp-102029 |
2021 |
Elsevier |
7.34
|
|
Influence of Variable Temperature on Performance of Mixed-MWCNT, MWCNT and SWCNT Nanostructures as Interconnects for High-Performance VLSI-IC Design |
P.K. Jindal, Karmjit Singh Sandha |
Journal of Materials Science: Materials in Electronics |
Vol.31, No. 3, pp. 1828-38 |
2020 |
Springer |
2.779
|
|
Himanshu Sharma, Karmjit Singh Sandha. |
Analog Integrated Circuits and Signal Processing, |
Vol. 104, No. 2, pp. 157-168 |
2020 |
Springer |
1.321 |
|
|
Impact of Intercalation Doping on the Conductivity of Multi-layer Graphene Nanoribbon (MLGNR) in On-Chip Interconnects |
Himanshu Sharma, Karmjit Singh Sandha |
Vol. 29, No. 12, pp. 2050185 |
2020 |
1.278 |
||
|
Thermally-Aware Modeling and Performance Analysis of MLGNR as On-Chip VLSI Interconnect Material |
Himanshu Sharma Karmjit S. Sandha* |
Journal of Electronic Materials |
Vol. 48, No. 8, pp. 4902-4912 |
2019
|
Springer |
2.048
|
|
Thermally-Aware Modeling and Performance Analysis of Mixed-MWCNTB as Very Large-Scale Integrated Interconnects Material for Nano-Electronic Integrated Circuits Design |
P.K. Jindal, Karmjit Singh Sandha* |
Journal of Nanoelectronics and Optoelectronics |
Vol. 14, pp. 1–12, (doi:10.1166/jno.2019.2635) |
2019 |
American Scientific Publishers. |
0.697
|
|
Comparative Analysis of Mixed CNTs and MWCNTs as VLSI Interconnects for Deep Sub-micron Technology Nodes |
Karmjit Singh Sandha* A. Thakur. |
Journal of Electronic Materials |
Vol. 48, No. 4, pp. 2543- 2554 |
2019 |
Springer |
2.048
|
|
Performance Analysis of Different Mixed-MWCNT Structures as VLSI Interconnects for Nano-Electronics Integrated Circuit Design. |
Karmjit Singh Sandha* and Shairy Sharma. |
Journal of Nanoelectronics and Optoelectronics |
Vol.13, No. 3, pp. 357-367(11).
|
2018 |
American Scientific Publishers |
0.697
|
|
Comparative Analysis of On-Chip Optical and Copper VLSI Interconnects for Deep Sub-Micron Technology Nodes. |
Karmjit Singh Sandha* M. Kumar |
Journal of Nanoelectronics and Optoelectronics |
Vol. 13, No. 2, pp. 267-274(8) |
2018 |
American Scientific Publishers. |
0.697
|
|
Impact of tunneling conductance on the performance of multi walled carbon nanotubes as VLSI interconnects for nano-scaled technology nodes |
P. Litoria, K.S. Sandha, A. Kansal |
Journal of Materials Science: Materials in Electronics |
Vol. 28, No. 6, pp 4818–4827. |
2017 |
Springer |
2.779
|
|
Multilayer Graphene Nanoribbon (MLGNR) as VLSI Interconnect Material at Nano-scaled Technology Nodes |
Himanshu Sharma, Karmjit Singh Sandha*. |
Vol. 19 No. 6, pp 456–461
|
2018 |
Springer
|
Scopus Indexed |
|
|
Performance analysis of temperature dependent Multi-walled Carbon Nanotubes as Global Interconnects at different technology nodes |
Karmjit Singh*, Balwinder Raj, |
Journal of Computational Electronics, Springer |
Vol. 14, No. 2, pp 469-476 |
2015 |
Springer
|
1.983 |
|
Influence of Temperature on MWCNT bundle, SWCNT bundle and Copper interconnects for Nanoscaled Technology nodes |
Karmjit Singh*, Balwinder Raj |
Journal of Materials Science: Materials in Electronics. Springer |
Vol. 26, No. 8, pp 6134-6142 |
2015 |
Springer
|
2.779 |
|
Temperature Dependent Modeling and Performance Evaluation of Multi-Walled CNT and Single-Walled CNT as Global Interconnects |
Karmjit Singh*, Balwinder Raj |
Journal of Electronic Materials, Springer |
Vol. 44, No. 12, pp 4825-4835 |
2015 |
Springer
|
2.048 |
SN |
Title |
Cost (in Lacs) |
Funding Agency |
Duration |
Co-PI (if any) |
1 |
Enhanced treatment of wastewater using a synergy of microalgae and microorganisms without energy investment and biofuel production |
42.5
|
T2CEFS |
3yrs |
Dr. Amit Dhir (PI) |
2 |
Development of low-cost and highly conductive carbon-nanotube/graphenesensors based physiological recording system |
14.1 |
CEEMS |
3 years |
Dr. Mandeep Singh (PI), Dr. Moon Inder Singh (Co-PI) |
3 |
MonSys IoT (Startup grant under TIDE 2.0 Scheme) |
4.0 |
MEITY-STEP |
1 year |
Dr. Amit Dir |
4 |
Indigenous Smart Perimeter Intrusion Detection System (SPIDS) |
5.23 |
UV Techno |
|
- |