Dr. Karmjit Singh Sandha

Associate Professor and Associate Head

Specialization

VLSI Interconnects, MWCNT Based Interconnects, Optical Interconnects and Embedded Systems

Email

kssandha@thapar.edu

Specialization

VLSI Interconnects, MWCNT Based Interconnects, Optical Interconnects and Embedded Systems

Email

kssandha@thapar.edu

 

PhD (MWCNT based VLSI Interconnects), M.Tech (ECE), B.E. (ECE)

Designation: Associate Professor and Associate Head

Department of Electronics and Communication Engineering.

Thapar Institute of Engineering and Technology, Patiala - 147004                                      

E-mail: kssandha@thapar.edu, aheced1@thapar.edu,

ks_sandha@yahoo.com       

Contacte No:  91-9646020543

 

  1. Qualification and Experience:
    1. Professional and Academic Qualifications: -
  • 2017    Course on “Embedded Entrepreneurship in Engineering Education” from University of Groningen, Groningen (Netherland)
  • 2015    PhD on MWCNT based VLSI Interconnects, from Thapar University Patiala, India.
  • 2007    M.Tech in Electronics & Communication Engineering from Punjab Technical University, Jalandhar, Punjab, India.       
  • 1999    B.E. in Electronics & Telecommunication Engineering from Amravati University, Amravati, India.
  1. Work Experience: (25 Years)
  • Have been serving as Associate Head, DECE in Thapar Institute of Engineering and Technology Patiala since 01-02-2024.
  • Have been serving as Associate Professor in Thapar Institute of Engineering and Technology Patiala since 01-07-2023.
  • Have been served as Assistant Professor in Thapar Institute of Engineering and Technology Patiala from 06-07-2009 to 30-06-2023.
  • Have served as Assistant Professor in Modi Institute of Technology & Sciences, Lakhshmangarh (a Deemed University) from 30-11-2007 to 04-07-2009.
  • Have served as Assistant Professor in Adesh Institute of Engineering & Technology, Faridkot from 31-05-2007 to 29-11-2007.
  • Have served as lecturer in Adesh Institute of Engineering & Technology, Faridkot from 07-08-1999 to 30-05-2007.
  1. Research Interest:
  • CNT based VLSI Interconnects.
  • Development of IoT based systems.
  • Optical Interconnects
  • CNT based Bio-medical Sensors
  • Embedded systems.

                                                                                                                                    

  1. Research Publications:

 

 

 

Sr. No.

Title of Paper

Author(s)

Name of the

Journal

Vol./ page numbers

Year

Publisher

Impact Factor

  1.  

GA optimized novel design and analysis of graphene-based antennas for THz spectroscopic security applications

G Singh, KS Sandha, A Kansal

 

Journal of Magnetism and Magnetic Materials

608, 172454

 

2024

Elsevier

2.5/Q3

  1.  

Broad microwave absorption bandwidth analysis of biocomposite microwave absorber material for X-band applications

A Tripathi, KS Sandha

 

 

Biomass Conversion and Biorefinery

 

doi.org/10.1007/s13399-024-06157-1

2024

Springer

3.5/Q2

  1.  

Investigation of Optical Interconnects for nano-scale VLSI applications.

A Singh, KS Sandha, MK Rai

Micro and Nanostructures

doi.org/10.1016/j.micrna.2024.207987

2024

Elsevier

2.7

  1.  

Variable Length and Temperature-Dependent Analysis of MLGNR at Nano-Scale Regime

H Sharma, KS Sandha

 

Nano

19 (03), 2450019

2024

World Scientific

1.0

  1.  

Thermally-aware circuit model and performance analysis of MLGNR for nano-interconnect application

H Sharma, KS Sandha

 

Analog Integrated Circuits and Signal Processing,

1-11

 

2024

Springer

1.321

  1.  

Design and Analysis of Active Feedback RGC-Based Transimpedance Receiver Circuit for Optical Interconnects

A Singh, KS Sandha, MK Rai

 

Journal of Circuits, Systems and Computers

33 (07), 2450125

 

2024

World Scientific

1.278

  1.  

Impact of sole layer duple substrates on GA-based optimised graphene antennas for THz applications

G Singh, KS Sandha, A Kansal

 

Nano Communication Networks

40, 100508

 

2024

Elsevier

2.9

  1.  

Rapid Fabrication Technique for Dry Electrocardiography Electrodes Using Carbon Nanotube/Polydimethylsiloxane Composite. 

Panchal, J., Singh, M.I., Sandha, K.S. and Singh, M.

Journal of Electronic Materials

53 (5), 2633-2645

2024

Springer

2.048

 

 

  1.  

GA based optimized graphene antenna design for detection of explosives and drugs using THz spectroscopy

Gurjeevan Singh, Karmjit Singh Sandha, Ankush Kansal

Micro and Nanostructures

Volume 179, July 2023, 207566

2023

 

Elsevier

3.2

  1.  

Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes

Gurleen Dhillon, Karmjit Singh Sandha

Journal of Electrical Engineering

Vol. 74, No. 1, 57–63

2023

Sciendo Paper

0.8

  1.  

Impact of thickness and wt. % on the dielectric properties of Sugarcane bagasse & MWCNT composite material as microwave absorber

Anju Tripathi, Karmjit Singh Sandha

Waste and Biomass Valorization

 

Vol.14

No. 6

Pages

2009-2024

 

2022

Springer

3.449

  1.  

Stability and Crosstalk Based Performance of Multi and Double-walled mixed CNT bundles as Interconnect for next-generation Technology nodes

Gurleen Dhillon, Karmjit Singh Sandha

Journal of Circuits, Systems and Computers

Vol. 31, No. 05, 2250098

2022

World Scientific

1.278

  1.  

Analytical Delay Model and Stability Analysis for MLGNR Interconnects

Himanshu Sharma, Karmjit Singh Sandha.

Journal of Circuits, Systems and Computers

Vol. 31, No. 15, 225s00260

2022

World Scientific

1.278

  1.  

Impact of channel parameters on threshold voltage at variable temperatures of Double-gate CNTFET

Aakanksha, Karmjit Singh Sandha

Micro and Nanostructures

Volume 164, April 2022, 107168

2022

 

Elsevier

3.22

  1.  

Mixed CNT bundles as VLSI interconnect for nanoscaled technology nodes

G. Dhillon, K.S.Sandha

Journal of Computational Electronics,

Vol.20, No. 1, pp. 248-258

2021

Springer

1.983

 

  1.  

Impact of thermally-aware environmental conditions on double gate carbon nanotube FET

Aakankshal, Karmjit Singh Sandha

Microelectronics Journal

Volume 114, pp- 105146

2021

Elsevier

2.2

  1.  

Coupled microalgal–bacterial biofilm for enhanced wastewater treatment without energy investment

Karmjit Singh Sandha, et. al

Journal of Water Process Engineering

Volume 41, pp-102029

2021

Elsevier

7.34

 

  1.  

Influence of Variable Temperature on Performance of Mixed-MWCNT, MWCNT and SWCNT Nanostructures as Interconnects for High-Performance VLSI-IC Design

P.K. Jindal, Karmjit Singh Sandha

Journal of Materials Science: Materials in Electronics

Vol.31, No. 3, pp. 1828-38

2020

Springer

2.779

 

  1.  

Investigation on the combined effects of variable Fermi energies and temperatures on the performance of multilayer graphene nanoribbon as interconnects

Himanshu Sharma, Karmjit Singh Sandha.

Analog Integrated Circuits and Signal Processing,

Vol. 104, No. 2, pp. 157-168

2020

Springer

1.321

  1.  

Impact of Intercalation Doping on the Conductivity of Multi-layer Graphene Nanoribbon (MLGNR) in On-Chip Interconnects

Himanshu Sharma, Karmjit Singh Sandha

Journal of Circuits, Systems and Computers,

Vol. 29, No. 12, pp. 2050185

2020

 World Scientific

1.278

  1.  

Thermally-Aware Modeling and Performance Analysis of MLGNR as On-Chip VLSI Interconnect Material

Himanshu Sharma Karmjit S. Sandha*

Journal of Electronic Materials

Vol. 48, No. 8, pp. 4902-4912

2019

 

Springer

2.048

 

 

  1.  

Thermally-Aware Modeling and Performance Analysis of Mixed-MWCNTB as Very Large-Scale Integrated Interconnects Material for Nano-Electronic Integrated Circuits Design

P.K. Jindal, Karmjit Singh Sandha*

Journal of Nanoelectronics and Optoelectronics

Vol. 14, pp. 1–12, (doi:10.1166/jno.2019.2635)

2019

American Scientific Publishers.

0.697

 

  1.  

Comparative Analysis of Mixed CNTs and MWCNTs as VLSI Interconnects for Deep Sub-micron Technology Nodes

Karmjit Singh Sandha*

A. Thakur.

Journal of Electronic Materials

 Vol. 48, No. 4, pp. 2543- 2554

2019

Springer

2.048

 

 

  1.  

Performance Analysis of Different Mixed-MWCNT Structures as VLSI Interconnects for Nano-Electronics Integrated Circuit Design

Karmjit Singh Sandha* and Shairy Sharma.

Journal of Nanoelectronics and Optoelectronics

Vol.13, No. 3, pp. 357-367(11).

 

2018

American Scientific Publishers

0.697

 

  1.  

Comparative Analysis of On-Chip Optical and Copper VLSI Interconnects for Deep Sub-Micron Technology Nodes.

Karmjit Singh Sandha* M. Kumar

Journal of Nanoelectronics and Optoelectronics

Vol. 13, No. 2, pp. 267-274(8)

2018

American Scientific Publishers.

0.697

 

  1.  

Impact of tunneling conductance on the performance of multi walled carbon nanotubes as VLSI interconnects for nano-scaled technology nodes

P. Litoria, K.S.

Sandha, A.  Kansal

Journal of Materials Science: Materials in Electronics

Vol. 28, No. 6,

pp 4818–4827.

2017

Springer

2.779

 

  1.  

Multilayer Graphene Nanoribbon (MLGNR) as VLSI Interconnect Material at Nano-scaled Technology Nodes

Himanshu Sharma, Karmjit Singh Sandha*.

Transactions on Electrical and Electronic Materials,

Vol. 19

No. 6,

pp 456–461

 

2018

Springer

 

 Scopus Indexed

  1.  

 Performance analysis of temperature dependent Multi-walled Carbon Nanotubes as Global Interconnects at different technology nodes

Karmjit Singh*, Balwinder Raj,

Journal of Computational Electronics, Springer

Vol. 14, No. 2pp 469-476

2015

Springer

 

1.983

  1.  

Influence of Temperature on MWCNT bundle, SWCNT bundle and Copper interconnects for Nanoscaled Technology nodes

Karmjit Singh*, Balwinder Raj

Journal of Materials Science: Materials in Electronics. Springer

Vol. 26, No. 8pp 6134-6142

2015

Springer

 

2.779

  1.  

Temperature Dependent Modeling and Performance Evaluation of Multi-Walled CNT and Single-Walled CNT as Global Interconnects

Karmjit Singh*, Balwinder Raj

Journal of Electronic Materials, Springer

Vol. 44, No. 12pp 4825-4835

2015

Springer

 

2.048

 

  1. Research guidance:
  • Ph.D Thesis Supervision      : 4 Completed, 4 ongoing (3 students has completed their objectives and writing thesis)
  • M.E./M.Tech Thesis Supervision                : 26 Awarded, 1 under Progress 

 

 

  1. Sponsored projects (Last five years)

 

SN

Title

Cost (in Lacs)

Funding Agency

Duration

Co-PI (if any)

1

Enhanced treatment of wastewater using a synergy of microalgae and microorganisms without energy investment and biofuel production

42.5

 

T2CEFS

3yrs

Dr. Amit Dhir (PI)

2

Development of low-cost and highly conductive carbon-nanotube/graphenesensors based physiological recording system

14.1

CEEMS

3 years

Dr. Mandeep Singh (PI), Dr. Moon Inder Singh (Co-PI)

3

MonSys IoT (Startup grant under TIDE 2.0 Scheme)

4.0

MEITY-STEP

1 year

Dr. Amit Dir

4

Indigenous Smart Perimeter Intrusion Detection System (SPIDS)

5.23

UV Techno

  1. year

-

 

  1. Member of Professional Societies
  • Member, IEEE
  • Life Member of ISTE.
  • Life member of IAENG, Hong Kong

 

  1. Administrative Experience
  • Associate Head, Department of Electronics and Communication Engineering, TIET, Patiala.
  • Coordinator, Placement and Internship, ECED TIET Patiala.
  • Member, Board of studies, ECED, TIET Patiala.
  • Member, Board of studies, ECED, Chandigarh Engineering College, Jhanjeri (Mohali).
  • Member, ECED Policy, and Planning committee (DPPC).
  • Co-coordinator, ABET-ENC.
  • Co-coordinator, NBA-ENC.
  • Co-coordinator, ECED, Experiential Learning Center, TIET, since 2018.
  • Member, Entrepreneurship, and Innovation team of TIET.
  • Coordinator, ECED Placement and Internship, since 2018
  • Lab Incharge of Microcontroller and Embedded Systems Lab since 2011-2024.
  • Departmental Coordinator of Time Table Committee.

 

                                                                                                                  

 

 

 

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