Department of Electronics and Communication Engineering - Thapar Institute of Engineering and Technology

Dr. Karmjit Singh Sandha

Associate Professor and Associate Head

Specialization

VLSI Interconnects, MWCNT Based Interconnects, Optical Interconnects and Embedded Systems

Email

kssandha@thapar.edu

Specialization

VLSI Interconnects, MWCNT Based Interconnects, Optical Interconnects and Embedded Systems

Email

kssandha@thapar.edu

PhD (MWCNT based VLSI Interconnects), M.Tech (ECE), B.E. (ECE)

Designation: Associate Professor and Associate Head

Department of Electronics and Communication Engineering.

Thapar Institute of Engineering and Technology, Patiala - 147004

E-mail: kssandha@thapar.edu, aheced1@thapar.edu,

ks_sandha@yahoo.com

Contacte No: 91-9646020543

Qualification and Experience:
1. Professional and Academic Qualifications: -

2017 Course on “Embedded Entrepreneurship in Engineering Education” from University of Groningen, Groningen (Netherland)
2015 PhD on MWCNT based VLSI Interconnects, from Thapar University Patiala, India.
2007 M.Tech in Electronics & Communication Engineering from Punjab Technical University, Jalandhar, Punjab, India.
1999 B.E. in Electronics & Telecommunication Engineering from Amravati University, Amravati, India.

Work Experience: (25 Years)

Have been serving as Associate Head, DECE in Thapar Institute of Engineering and Technology Patiala since 01-02-2024.
Have been serving as Associate Professor in Thapar Institute of Engineering and Technology Patiala since 01-07-2023.
Have been served as Assistant Professor in Thapar Institute of Engineering and Technology Patiala from 06-07-2009 to 30-06-2023.
Have served as Assistant Professor in Modi Institute of Technology & Sciences, Lakhshmangarh (a Deemed University) from 30-11-2007 to 04-07-2009.
Have served as Assistant Professor in Adesh Institute of Engineering & Technology, Faridkot from 31-05-2007 to 29-11-2007.
Have served as lecturer in Adesh Institute of Engineering & Technology, Faridkot from 07-08-1999 to 30-05-2007.

Research Interest:

CNT based VLSI Interconnects.
Development of IoT based systems.
Optical Interconnects
CNT based Bio-medical Sensors
Embedded systems.

Research Publications:

Sr. No.	Title of Paper	Author(s)	Name of the Journal	Vol./ page numbers	Year	Publisher	Impact Factor
	GA optimized novel design and analysis of graphene-based antennas for THz spectroscopic security applications	G Singh, KS Sandha, A Kansal	Journal of Magnetism and Magnetic Materials	608, 172454	2024	Elsevier	2.5/Q3
	Broad microwave absorption bandwidth analysis of biocomposite microwave absorber material for X-band applications	A Tripathi, KS Sandha	Biomass Conversion and Biorefinery	doi.org/10.1007/s13399-024-06157-1	2024	Springer	3.5/Q2
	Investigation of Optical Interconnects for nano-scale VLSI applications.	A Singh, KS Sandha, MK Rai	Micro and Nanostructures	doi.org/10.1016/j.micrna.2024.207987	2024	Elsevier	2.7
	Variable Length and Temperature-Dependent Analysis of MLGNR at Nano-Scale Regime	H Sharma, KS Sandha	Nano	19 (03), 2450019	2024	World Scientific	1.0
	Thermally-aware circuit model and performance analysis of MLGNR for nano-interconnect application	H Sharma, KS Sandha	Analog Integrated Circuits and Signal Processing,	1-11	2024	Springer	1.321
	Design and Analysis of Active Feedback RGC-Based Transimpedance Receiver Circuit for Optical Interconnects	A Singh, KS Sandha, MK Rai	Journal of Circuits, Systems and Computers	33 (07), 2450125	2024	World Scientific	1.278
	Impact of sole layer duple substrates on GA-based optimised graphene antennas for THz applications	G Singh, KS Sandha, A Kansal	Nano Communication Networks	40, 100508	2024	Elsevier	2.9
	Rapid Fabrication Technique for Dry Electrocardiography Electrodes Using Carbon Nanotube/Polydimethylsiloxane Composite.	Panchal, J., Singh, M.I., Sandha, K.S. and Singh, M.	Journal of Electronic Materials	53 (5), 2633-2645	2024	Springer	2.048
	GA based optimized graphene antenna design for detection of explosives and drugs using THz spectroscopy	Gurjeevan Singh, Karmjit Singh Sandha, Ankush Kansal	Micro and Nanostructures	Volume 179, July 2023, 207566	2023	Elsevier	3.2
	Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes	Gurleen Dhillon, Karmjit Singh Sandha	Journal of Electrical Engineering	Vol. 74, No. 1, 57–63	2023	Sciendo Paper	0.8
	Impact of thickness and wt. % on the dielectric properties of Sugarcane bagasse & MWCNT composite material as microwave absorber	Anju Tripathi, Karmjit Singh Sandha	Waste and Biomass Valorization	Vol.14 No. 6 Pages 2009-2024	2022	Springer	3.449
	Stability and Crosstalk Based Performance of Multi and Double-walled mixed CNT bundles as Interconnect for next-generation Technology nodes	Gurleen Dhillon, Karmjit Singh Sandha	Journal of Circuits, Systems and Computers	Vol. 31, No. 05, 2250098	2022	World Scientific	1.278
	Analytical Delay Model and Stability Analysis for MLGNR Interconnects	Himanshu Sharma, Karmjit Singh Sandha.	Journal of Circuits, Systems and Computers	Vol. 31, No. 15, 225s00260	2022	World Scientific	1.278
	Impact of channel parameters on threshold voltage at variable temperatures of Double-gate CNTFET	Aakanksha, Karmjit Singh Sandha	Micro and Nanostructures	Volume 164, April 2022, 107168	2022	Elsevier	3.22
	Mixed CNT bundles as VLSI interconnect for nanoscaled technology nodes	G. Dhillon, K.S.Sandha	Journal of Computational Electronics,	Vol.20, No. 1, pp. 248-258	2021	Springer	1.983
	Impact of thermally-aware environmental conditions on double gate carbon nanotube FET	Aakankshal, Karmjit Singh Sandha	Microelectronics Journal	Volume 114, pp- 105146	2021	Elsevier	2.2
	Coupled microalgal–bacterial biofilm for enhanced wastewater treatment without energy investment	Karmjit Singh Sandha, et. al	Journal of Water Process Engineering	Volume 41, pp-102029	2021	Elsevier	7.34
	Influence of Variable Temperature on Performance of Mixed-MWCNT, MWCNT and SWCNT Nanostructures as Interconnects for High-Performance VLSI-IC Design	P.K. Jindal, Karmjit Singh Sandha	Journal of Materials Science: Materials in Electronics	Vol.31, No. 3, pp. 1828-38	2020	Springer	2.779
	Investigation on the combined effects of variable Fermi energies and temperatures on the performance of multilayer graphene nanoribbon as interconnects	Himanshu Sharma, Karmjit Singh Sandha.	Analog Integrated Circuits and Signal Processing,	Vol. 104, No. 2, pp. 157-168	2020	Springer	1.321
	Impact of Intercalation Doping on the Conductivity of Multi-layer Graphene Nanoribbon (MLGNR) in On-Chip Interconnects	Himanshu Sharma, Karmjit Singh Sandha	Journal of Circuits, Systems and Computers,	Vol. 29, No. 12, pp. 2050185	2020	World Scientific	1.278
	Thermally-Aware Modeling and Performance Analysis of MLGNR as On-Chip VLSI Interconnect Material	Himanshu Sharma Karmjit S. Sandha*	Journal of Electronic Materials	Vol. 48, No. 8, pp. 4902-4912	2019	Springer	2.048
	Thermally-Aware Modeling and Performance Analysis of Mixed-MWCNTB as Very Large-Scale Integrated Interconnects Material for Nano-Electronic Integrated Circuits Design	P.K. Jindal, Karmjit Singh Sandha*	Journal of Nanoelectronics and Optoelectronics	Vol. 14, pp. 1–12, (doi:10.1166/jno.2019.2635)	2019	American Scientific Publishers.	0.697
	Comparative Analysis of Mixed CNTs and MWCNTs as VLSI Interconnects for Deep Sub-micron Technology Nodes	Karmjit Singh Sandha* A. Thakur.	Journal of Electronic Materials	Vol. 48, No. 4, pp. 2543- 2554	2019	Springer	2.048
	Performance Analysis of Different Mixed-MWCNT Structures as VLSI Interconnects for Nano-Electronics Integrated Circuit Design.	Karmjit Singh Sandha* and Shairy Sharma.	Journal of Nanoelectronics and Optoelectronics	Vol.13, No. 3, pp. 357-367(11).	2018	American Scientific Publishers	0.697
	Comparative Analysis of On-Chip Optical and Copper VLSI Interconnects for Deep Sub-Micron Technology Nodes.	Karmjit Singh Sandha* M. Kumar	Journal of Nanoelectronics and Optoelectronics	Vol. 13, No. 2, pp. 267-274(8)	2018	American Scientific Publishers.	0.697
	Impact of tunneling conductance on the performance of multi walled carbon nanotubes as VLSI interconnects for nano-scaled technology nodes	P. Litoria, K.S. Sandha, A. Kansal	Journal of Materials Science: Materials in Electronics	Vol. 28, No. 6, pp 4818–4827.	2017	Springer	2.779
	Multilayer Graphene Nanoribbon (MLGNR) as VLSI Interconnect Material at Nano-scaled Technology Nodes	Himanshu Sharma, Karmjit Singh Sandha*.	Transactions on Electrical and Electronic Materials,	Vol. 19 No. 6, pp 456–461	2018	Springer	Scopus Indexed
	Performance analysis of temperature dependent Multi-walled Carbon Nanotubes as Global Interconnects at different technology nodes	Karmjit Singh*, Balwinder Raj,	Journal of Computational Electronics, Springer	Vol. 14, No. 2, pp 469-476	2015	Springer	1.983
	Influence of Temperature on MWCNT bundle, SWCNT bundle and Copper interconnects for Nanoscaled Technology nodes	Karmjit Singh*, Balwinder Raj	Journal of Materials Science: Materials in Electronics. Springer	Vol. 26, No. 8, pp 6134-6142	2015	Springer	2.779
	Temperature Dependent Modeling and Performance Evaluation of Multi-Walled CNT and Single-Walled CNT as Global Interconnects	Karmjit Singh*, Balwinder Raj	Journal of Electronic Materials, Springer	Vol. 44, No. 12, pp 4825-4835	2015	Springer	2.048

Research guidance:

Ph.D Thesis Supervision : 4 Completed, 4 ongoing (3 students has completed their objectives and writing thesis)
M.E./M.Tech Thesis Supervision : 26 Awarded, 1 under Progress

Sponsored projects (Last five years)

SN	Title	Cost (in Lacs)	Funding Agency	Duration	Co-PI (if any)
1	Enhanced treatment of wastewater using a synergy of microalgae and microorganisms without energy investment and biofuel production	42.5	T2CEFS	3yrs	Dr. Amit Dhir (PI)
2	Development of low-cost and highly conductive carbon-nanotube/graphenesensors based physiological recording system	14.1	CEEMS	3 years	Dr. Mandeep Singh (PI), Dr. Moon Inder Singh (Co-PI)
3	MonSys IoT (Startup grant under TIDE 2.0 Scheme)	4.0	MEITY-STEP	1 year	Dr. Amit Dir
4	Indigenous Smart Perimeter Intrusion Detection System (SPIDS)	5.23	UV Techno	year	-

Member of Professional Societies

Member, IEEE
Life Member of ISTE.
Life member of IAENG, Hong Kong

Administrative Experience

Associate Head, Department of Electronics and Communication Engineering, TIET, Patiala.
Coordinator, Placement and Internship, ECED TIET Patiala.
Member, Board of studies, ECED, TIET Patiala.
Member, Board of studies, ECED, Chandigarh Engineering College, Jhanjeri (Mohali).
Member, ECED Policy, and Planning committee (DPPC).
Co-coordinator, ABET-ENC.
Co-coordinator, NBA-ENC.
Co-coordinator, ECED, Experiential Learning Center, TIET, since 2018.
Member, Entrepreneurship, and Innovation team of TIET.
Coordinator, ECED Placement and Internship, since 2018
Lab Incharge of Microcontroller and Embedded Systems Lab since 2011-2024.
Departmental Coordinator of Time Table Committee.

Specialization

Email

Contacte No: 91-9646020543

Waste and Biomass Valorization

Title

MonSys IoT (Startup grant under TIDE 2.0 Scheme)

Indigenous Smart Perimeter Intrusion Detection System (SPIDS)