Specialization

Modeling and Design of Carbon Nanotube based VLSI Interconnects, Analog VLSI Design, Nanotechnology, Hyperthermia applicator

Email

mkrai@thapar.edu

Designation:    Professor

Department:    Electronics and Communication Engineering

Email:             mkrai@thapar.edu

Qualification:  Ph.D, M.Tech (VLSI Design), Advanced diploma (VLSI Design), B.E.(ECE)

Area of Interest:

• Modeling, Design and optimization of nano-scale Interconnects based on CNT and GNR                    
• Analog VLSI Design
• Nanotechnology
• Hyperthermia applicator

Number of publications:

Research Supervision:

PhD Thesis (completed) : 02

1. Name: Tajinder Kaur

                Topic & Year: PERFORMANCE ANALYSIS OF MLGNR AS VLSI INTERCONNECTS,2021

2. Name: Manvi Sharma

            Topic & year: THERMALLY AWARE PERFORMANCE ANALYSIS OF MIXED CARBON NANOTUBE BASED VLSI INTERCONNECTS, 2022

                   3. Name : Ramneek Sidhu

           Topic & Year: Modeling, Analysis and Design of Doped MLGNR Interconnects for Subthreshold Circuits, 2023. Fellowship: NET

PhD Thesis (ongoing):  05

M.Tech Thesis guided : 29

Research Grants: 02

            Other Responsibility:

• Lab in-charge Electronics                    
• PhD Coordinator (Thesis Submission)

SCI Publications

1. Amoldeep Singh, K.S.Sandha and Mayank Kumar Rai, “Design and Analysis of Active Feedback RGC-based Transimpedance Receiver Circuit for Optical Interconnects” Journal of Circuits, Systems, and Computers (JCSC), Accepted and in press,2023.

2. Hitender Gupta, Rajesh Khanna and Mayank Kumar Rai “An Improved Biodegradable Microwave Absorber Based on Peanut Shell Mixed with Metal Free Carbon Nanotube for Ku-Band” Waste and Biomass Valorization, Accepted and in press,2023.

3. Tajinder Kaur, Mayank Kumar Rai, R.Khanna, “Design Issues in Intercalation Doped-Multilayer Graphene Nanoribbon Based Future Interconnects in Deep Submicron Regime”, NANO (World Scientific Publishing Company), Accepted and in press,2023.

4. Akanksha Upadhyay, Mayank Kumar Rai and Rajesh Khanna,“Analyis of Multilayer Graphene Nanoribbon Interconnects Constrained by Structural Edge Roughness and Corrugated Surface Dielectric”, ”, physica status solidi a (PSSA) (Journal of Wiley), DOI:10.1002/pssa.202200431,2022.

5. Ritika Sharma, Mayank Kumar Rai and Rajesh Khanna “Structure optimization: Configuring optimum performance of randomly distributed mixed carbon nanotube bundle interconnects” International Journal Of Circuit Theory And Applications (Journal of Wiley), DOI: 10.1002/cta.3605,2023.

6. Akanksha Upadhyay, Mayank Kumar Rai and Rajesh Khanna, “Analysis of Multilayer Graphene Nanoribbon Interconnects Constrained by Structural Edge Roughness and Corrugated Surface Dielectric”, physica status solidi a (PSSA) (Journal of Wiley), DOI:10.1002/pssa.202200431,2022.

7. Ramneek Sidhu and Mayank Kumar Rai, “Transient Analysis in Doped MLGNR for Subthreshold Interconnects under Process Induced Physical and Geometrical Parameters”, Journal of Computational Electronics (JCEL), accepted and in press,2022.
8. Ramneek Sidhu and Mayank Kumar Rai, “Electronic Transport in doped and dielectric inserted MLGNR interconnects: Crosstalk induced delay and stability analyses at sub-threshold regime”,  Microelectronic Journal, Vol. 128, 105524,DOI:10.1016/j.mejo.2022.105524, October 2022.
9. Manvi Sharma, Mayank Kumar Rai and Rajesh Khanna, “Dielectric surface roughness scattering induced crosstalk performance of coupled MCB interconnects”, Microelectronic Journal, DOI:10.1016/j.mejo.105084, 17 May 2021.
10. Ramneek Sidhu and Mayank Kumar Rai, “Edge Scattering Limited Crosstalk Analysis in Adjacent Multilayer Graphene Interconnects and its impact on Gate Oxide Reliability”, Circuit world, DOI:10.1108/CW-09-2020-0233,May 2021.
11. Tajinder Kaur, Mayank Kumar Rai and Rajesh Khanna, “Analytical Frequency‐Domain Model for Coupled Interconnects of Doped Multilayer Graphene Nanoribbons and Mixed Carbon Nanotube Bundles”, physica status solidi a(PSSA), DOI: 10.1002/pssa.202000588,2020.
12. Tajinder Kaur, Mayank Kumar Rai and Rajesh Khanna, “Temperature-Dependent Circuit Modeling and Performance Evaluation Due to Crosstalk in Capacitively Coupled Interconnects of Intercalation-Doped Multilayer Graphene Nanoribbon” Arabian Journal for Science and Engineering, DOI:10.1007/s13369-020-04892-x,2020.
13. Manvi Sharma, Mayank Kumar Rai and Rajesh Khanna , “Performance analysis of MCB-based VLSI interconnects depending on scattering induced by substrate surface roughness”, Journal of Computational Electronics (JCEL),vol. 20, pages709–717,2020.
14. Manvi Sharma, Mayank Kumar Rai and Rajesh Khanna , “Performance analysis of irradiation induced defected mixed CNT bundle based coupled VLSI interconnects” Journal of Materials Science: Materials in Electronics, DOI: 10.1007/s10854-020-04670-3,2020.
15. Ramneek Sidhu, Mayank Kumar Rai & B. K. Kaushik “Temperature-dependent crosstalk between adjacent MLGNR interconnects of different dimensions and its impact on gate oxide reliability”, Journal of  Computational Electronics, DOI 10.1007/s10825-020-01444-2,2020.
16. Manvi Sharma, Mayank Kumar Rai and Rajesh Khanna“Temperature-dependent crosstalk and frequency spectrum analyses in adjacent interconnects of a mixed CNT bundle”, Journal of Computational Electronics (JCEL), DOI:10.1007/s10825-019-01405-4,2019.
17. Tajinder Kaur, Mayank Kumar Rai and Rajesh Khanna, “Analysis of Temperature Dependent Functional and Dynamic Crosstalk Noise in Adjacent Interconnects of Doped MLGNR with Armchair and Zigzag Edges”, physica status solidi a(PSSA), DOI: DOI: 10.1002/pssa.201900591,2019
18. Tajinder Kaur,Mayank Kumar Rai and Rajesh Khanna, “Effect of temperature on the performance analysis of MLGNR interconnects” Journal of Computational Electronics (JCEL), DOI:10.1007/s10825-018-01297-w,2019.
19. Mayank Kumar Rai, Shubham Arora and B.K. Kaushik “Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects” International Journal Of Circuit Theory And Applications (Journal of Wiley), DOI: 10.1002/cta.2384 , pp. 1–14, 2017.
20. Mayank Kumar Rai, Harsh Garg & B. K. Kaushik “Temperature-Dependent Modeling and Crosstalk Analysis in Mixed Carbon Nanotube Bundle Interconnects” Journal of Electronic Materials, DOI 10.1007/s11664-017-5538-1, 2017.
21. Shilpa Agrawal ,Mayank Kumar Rai, Rajesh khanna and Sankar Sarkar, “Thermally aware circuit modeling and  performance analysis of single-walled carbon nanotube bundle as VLSI interconnects” Scientia Iranica Journal, Volume 24 - Number 3,pp.1626-1634, November 2016.
22. Mayank Kumar Rai, Ashoke Kumar Chatterjee ,Sankar Sarkar and B.K.Kaushik, “Performance Analysis of Multilayer Graphene Nanoribbon(MLGNR) Interconnects”, Journal of Computational Electronics (JCEL), DOI:10.1007/s10825-015-0786-x,2016.
23. Mayank Kumar Rai, B.K.Kaushik and S.Sankar, “Thermally aware performance analysis of single-walled carbon nanotube bundle as VLSI interconnects”, Journal of Computational Electronics ,vol.15(2),pp.407-419,2016.
24. Mayank Kumar Rai and Sankar Sarkar ,“Temperature dependant crosstalk analysis in coupled single-walled carbon nanotube (SWCNT) bundle interconnects” International Journal Of Circuit Theory And Applications (Journal of Wiley), DOI: 10.1002/cta,2014.
25. Mayank Kumar Rai, Rajesh Khanna and Sankar Sarkar,“Crosstalk   analysis in CNT bundle interconnects for VLSI application,” IEEJ Transaction on Electrical and  Electronic Engineering,(Journal of Wiley), vol. 9,   no.4,pp.390-397,2014.
26. Mayank Kumar Rai, Rajesh Khanna and Sankar Sarkar “Control of tube parameters on SWCNT Bundle  Interconnect Delay and Power Dissipation,” Microelectronics International, volume 31, issue 1, pp.24–31, 2013.
27. Mayank Kumar Rai and Sankar Sarkar, “Influence of distance between adjacent Tubes on SWCNT bundle interconnect delay and power dissipation,” Journal of Computational Electronics (JCEL), December 2013, Volume 12, Issue 4, pp 796-802,(Journal of Springer).
28. Mayank Kumar Rai and Sankar Sarkar, “Influence of tube diameter on carbon  nanotube interconnect delay  and power output,” physica status solidi (a), vol.208, issue.no.3,pp.735-739, 2011, (Journal of Wiley).

            Book chapter(Science index)

1. Book chapter accepted Titled “Carbon nano tube as VLSI Interconnect", in the book Titled "Carbon Nanotubes / Book 5", ISBN 978-953-307-499-3, Publisher: InTech Open Access, Austria. Authors Name: Mayank Kumar Rai and Sankar Sarkar.

           Patent

1. Sharma, M., Rai, M.K. 2021. Rough Surface scattering induced capacitively coupled mixed CNT bundle (MCB) interconnects. Indian Patent, 202111038795, published on 10th Sept’ 2021.

Important International Conference Papers:

1. Nitika Sharma, Amritpal Singh, Rajesh Khanna, Mayank Kumar Rai, Neeraj Kumar, Hari Shankar Singh,Amanpreet Kaur, Mayank Agarwal, Raja Paramjit Singh Banipal, and Vinod Kumar Dangwal , “Design a Focused Radome Applicator for Small Tumors Treatment”, Proceeding on IAHOM, Bengaluru, August 12^th - 13^th,2023.
2. Hitender Gupta; Rajesh Khanna; Mayank Kumar Rai, “Enhanced Microwave Absorption Performance of Agriculture Corn Husk waste mixing with CNT”, Proceeding on IEEE First International Conference on Microwave, Antenna and Communication (MAC), Prayagraj, 24-26 March, 2023.
3. Ramneek Sidhu and Mayank Kumar Rai, “Influence of width and Space on Crosstalk Analysis in Adjacent MLGNR interconnects”, Proceeding on IEEE TENCON,18th-21^st October,2019.
4. Manvi Sharma,Mayank Kumar Rai and Rajesh Khanna, “Temperature-dependent analysis of Crosstalk noise in Capacitively Coupled Interconnects for Mixed Carbon Nanotubes Bundle”,Proceeding on IEEE TENCON,18th-21^st October,2019.
5. Tajinder Kaur,Mayank Kumar Rai and Rajesh Khanna, “Influence of Temperature Variation on Frequency Spectrum Analysis of Intercalation Doped MLGNR Interconnects”,Proceeding on IEEE TENCON,18th-21^st October,2019.
6. Surabhi Sarda and Mayank Kumar Rai, “ Temperature-dependent Delay, Power and Frequency Analysis of Multilayer Graphene Nanoribbon Interconnects”Proceeding on IEEE TENCON,Jeju,South Korea, (28-31)October 2018.
7. Saurabh lavaniya , Satbir singh  and Mayank Kumar Rai “Temperature-dependent modeling and performance analysis of single-walled carbon nanotube(SWCNT) bundle interconnects”,Proceeding on IEEE TENCON, Marina Bay Sands, Singapore, November 22 – 25, 2016.
8. Mayank Kumar Rai “Thermally aware crosstalk analysis in Coupled SWCNT bundle interconnects”,IEEE based International conference on  CODEC-15, Calcutta university,Kolkata,18 December 2015.
9. Mayank kumar rai , Nivedita, G.Spandana, S.sarkar, “Control of SWCNT- Interconnect Performance by  Tube  diameter”, in proc. Intl.Conf. on Circuits and Systems, IEEE Tencon 2009,24-27^th Nov.2009.Singapore.
10. Mayank kumar rai , G.Spandana, Nivedita, S.sarkar, “Power Dissipation in SWCNT Interconnect” In proc.4^th  Intl.Conf. on Computers and Devices for Communication (CODEC09), 14–16^th Dec,2009, organized by Institute NEV  of Radio Physics & Electronics ,University of Calcutta, Kolkata,India, sponsored by IEEE, IEEE GRSS and Electron  Devices society sponsored.